| 摘要 |
A chemical-mechanical polishing (CMP) composition comprising (A) inorganic particles, organic particles, or a composite or mixture thereof, (B) a polymeric polyamine or a salt thereof comprising at least one type of pendant group (Y) which comprises at least one moiety (Z), wherein (Z) is a carboxylate (-COOR1), sulfonate (-SO3R2), sulfate (-O-SO3R3), phosphonate (-P(=O) (OR4)(OR5)), phosphate (-O-P(=O)(OR6)(OR7)), carboxylic acid (-COOH), sulfonic acid (-SO3H), sulfuric acid (-O-SO3-), phosphonic acid (-P(=O)(OH)2), phosphoric acid (-O-P(=O)(OH)2) moiety, or their deprotonated forms, R1 is alkyl, aryl, alkylaryl, or arylalkyl R2 is alkyl, aryl, alkylaryl, or arylalkyl, R3 is alkyl, aryl, alkylaryl, or arylalkyl, R4 is alkyl, aryl, alkylaryl, or arylalkyl, R5 is H, alkyl, aryl, alkylaryl, or arylalkyl, R6 is alkyl, aryl, alkylaryl, or arylalkyl, R7 is H, alkyl, aryl, alkylaryl, or arylalkyl, and (C) an aqueous medium. |
