发明名称 |
ENCAPSULATING LAYER-COVERED SEMICONDUCTOR ELEMENT, PRODUCING METHOD THEREOF, AND SEMICONDUCTOR DEVICE |
摘要 |
A method for producing an encapsulating layer-covered semiconductor element includes the steps of preparing a support sheet including a hard support board; disposing a semiconductor element at one side in a thickness direction of the support sheet; disposing an encapsulating layer formed from an encapsulating resin composition containing a curable resin at the one side in the thickness direction of the support sheet so as to cover the semiconductor element; curing the encapsulating layer to encapsulate the semiconductor element by the encapsulating layer that is flexible; cutting the encapsulating layer that is flexible corresponding to the semiconductor element to produce an encapsulating layer-covered semiconductor element; and peeling the encapsulating layer-covered semiconductor element from the support sheet. |
申请公布号 |
US2014001656(A1) |
申请公布日期 |
2014.01.02 |
申请号 |
US201313914158 |
申请日期 |
2013.06.10 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
EBE YUKI;KATAYAMA HIROYUKI;KIMURA RYUICHI;ONISHI HIDENORI;FUKE KAZUHIRO |
分类号 |
H01L21/56;H01L23/28;H01L33/52 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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