发明名称 |
SEMICONDUCTOR PACKAGE WITH AIR PRESSURE SENSOR |
摘要 |
A semiconductor package having an air pressure sensor and methods to form a semiconductor package having an air pressure sensor are described. For example, a semiconductor package includes a plurality of build-up layers. A cavity is disposed in one or more of the build-up layers. An air pressure sensor is disposed in the plurality of build-up layers and includes the cavity and an electrode disposed above the cavity. Also described are various approaches to fabricating a semiconductor package having a hermetically sealed region. |
申请公布号 |
US2014000377(A1) |
申请公布日期 |
2014.01.02 |
申请号 |
US201213536210 |
申请日期 |
2012.06.28 |
申请人 |
LIN KEVIN L.;MA QING;EID FERAS;SWAN JOHANNA;TEH WENG HONG |
发明人 |
LIN KEVIN L.;MA QING;EID FERAS;SWAN JOHANNA;TEH WENG HONG |
分类号 |
H01L29/84;G01L9/00 |
主分类号 |
H01L29/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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