发明名称 |
PACKAGE-ON-PACKAGE STRUCTURE HAVING POLYMER-BASED MATERIAL FOR WARPAGE CONTROL |
摘要 |
A package on package structure providing mechanical strength and warpage control includes a first package component, a second package component, and a first set of conductive elements coupling the first package component to the second package component. A first polymer-comprising material is molded on the first package component and surrounds the first set of conductive elements. The first polymer-comprising material has an opening therein exposing a top surface of the second package component. A third package component and a second set of conductive elements couples the second package component to the third package component. |
申请公布号 |
US2014001652(A1) |
申请公布日期 |
2014.01.02 |
申请号 |
US201213539136 |
申请日期 |
2012.06.29 |
申请人 |
CHEN MENG-TSE;LIU YU-CHIH;HUANG HUI-MIN;LIN WEI-HUNG;LU JING RUEI;CHENG MING-DA;LIU CHUNG-SHI;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
CHEN MENG-TSE;LIU YU-CHIH;HUANG HUI-MIN;LIN WEI-HUNG;LU JING RUEI;CHENG MING-DA;LIU CHUNG-SHI |
分类号 |
H01L23/52;H01L21/50 |
主分类号 |
H01L23/52 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|