发明名称 VERTICALLY STRUCTURED GROUP III NITRIDE SEMICONDUCTOR LED CHIP AND METHOD FOR MANUFACTURING THE SAME
摘要 A method for manufacturing vertically structured Group III nitride semiconductor LED chips includes a step of forming a light emitting laminate on a growth substrate; a step of forming a plurality of separate light emitting structures by partially removing the light emitting laminate to partially expose the growth substrate; a step of forming a conductive support on the plurality of light emitting structures; a step of lifting off the growth substrate from the plurality of light emitting structures; and a step of cutting the conductive support thereby singulating a plurality of LED chips each having the light emitting structure. The step of partially removing the light emitting laminate is performed such that each of the plurality of light emitting structures has a top view shape of a circle or a 4n-gon ("n" is a positive integer) having rounded corners.
申请公布号 US2014001511(A1) 申请公布日期 2014.01.02
申请号 US201314017889 申请日期 2013.09.04
申请人 DOWA ELECTRONICS MATERIALS CO., LTD.;WAVESQUARE INC. 发明人 CHO MEOUNG WHAN;LEE SEOG WOO;JANG PIL GUK;TOBA RYUICHI;TOYOTA TATSUNORI;KADOWAKI YOSHITAKA
分类号 H01L33/32 主分类号 H01L33/32
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