发明名称 |
Die Attach Pick Error Detection |
摘要 |
Embodiments of the invention provide a method to detect pick and place indexing errors on each manufacturing batch (lot) of semiconductor wafer processed during a die attach process using a preselected skeleton of check die. The known locations of the check skeleton die are verified during picking of die from the wafer. If the check skeleton cannot be correctly verified at the known locations, then a pick error is indicated. The embodiments may be implemented on existing die attach equipment. |
申请公布号 |
US2014002128(A1) |
申请公布日期 |
2014.01.02 |
申请号 |
US201313926969 |
申请日期 |
2013.06.25 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
OHMART DALE;SUBRAMANIAN BALAMURUGAN;LEANO RENATO HERACLEO ORDUNA;DIPASUPIL SONNY EVANGELISTA;PERALTA RONALD JAY V. |
分类号 |
G01R31/3185 |
主分类号 |
G01R31/3185 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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