发明名称 |
SEMICONDUCTOR PACKAGES HAVING INCREASED INPUT/OUTPUT CAPACITY AND RELATED METHODS |
摘要 |
A semiconductor package includes leads around the periphery of a chip and leads under the chip having connecting segments for increasing I/O capability. A filling material may be used under the chip, which may provide a lead locking function. Various methods of forming the semiconductor package are further provided. |
申请公布号 |
US2014001621(A1) |
申请公布日期 |
2014.01.02 |
申请号 |
US201313975717 |
申请日期 |
2013.08.26 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
LIAO GUO-CHENG |
分类号 |
H01L23/495;H01L23/00 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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