发明名称 HIGH HEAT CAPACITY ELECTRONIC COMPONENTS AND METHODS FOR FABRICATING
摘要 An apparatus may include an electrical component body, where the electrical component body is operative to vary power during operation. The apparatus may also include a thermal component in contact with at least a portion of the electrical component body, in which the thermal component comprises a matrix material, and a thermal energy storage material embedded in the matrix material to absorb heat generated by the electrical component body. Other embodiments are disclosed and claimed.
申请公布号 US2014002998(A1) 申请公布日期 2014.01.02
申请号 US201213535751 申请日期 2012.06.28
申请人 PIDWERBECKI DAVID;UAN-ZO-LI ALEXANDER B.;INTEL CORPORATION 发明人 PIDWERBECKI DAVID;UAN-ZO-LI ALEXANDER B.
分类号 H05K7/20;B21D53/02;H05K3/30 主分类号 H05K7/20
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