发明名称 |
CHIP PACKAGE AND METHODS FOR MANUFACTURING A CHIP PACKAGE |
摘要 |
A method for manufacturing a chip package is provided, the method including: forming a layer arrangement over a carrier; arranging a chip including one or more contact pads over the layer arrangement wherein the chip covers at least part of the layer arrangement; and selectively removing one or more portions of the layer arrangement and using the chip as a mask such that at least part of the layer arrangement covered by the chip is not removed. |
申请公布号 |
US2014001634(A1) |
申请公布日期 |
2014.01.02 |
申请号 |
US201213534144 |
申请日期 |
2012.06.27 |
申请人 |
TORWESTEN HOLGER;MENGEL MANFRED;INFINEON TECHNOLOGIES AG |
发明人 |
TORWESTEN HOLGER;MENGEL MANFRED |
分类号 |
H01L23/52;H01L21/60 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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