Method of manufacturing a light emitting diode

摘要

A method of manufacturing an LED according to an embodiment of the present invention includes:
back-grinding a substrate (12) of an LED wafer including the substrate (12) and a light emitting element (11) formed on one surface of the substrate;
forming, after the back-grinding, a reflective layer on an outer side of the substrate; and
attaching, on an outer side of the light emitting element of the LED wafer, a heat-resistant pressure-sensitive adhesive sheet (20).