| 摘要 |
PURPOSE: A clamp for wire bonding is provided to easily check a bad wire bonding by using a solder ball formed PCB(Printed Circuit Board) as a clamp. CONSTITUTION: A clamp for wire boning comprises a resin substrate, a chip mounting plate on the center portion of the resin substrate, a semiconductor chip(1) mounted on the chip mounting plate, a multiple of conductive traces respectively isolated with a defined distance from the chip mounting plate, first PCBs having solder ball lands(14) located on the conductive traces, and second PCBs as a clamp(20) respectively having a number of solder balls(21) electrically connected to first PCBs through the solder ball lands(14) on the first PCBs. At this point, the solder balls are electrically connected to the second PCBs. |
