| 摘要 |
A polishing pad has a sublayer; a top layer attached to the sublayer, the sublayer having a modulus of elasticity between 300 and 5000 psi and a compressibility of less than 30% at 73 psi, wherein the top pad has a modulus of elasticity which is greater than the modulus of elasticity of the sublayer and a compressibility which is smaller than a compressibility of the sublayer.
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