发明名称 |
METHOD FOR JOINING SUBSTRATES |
摘要 |
The invention relates to a method of joining substrates. It is the object of the invention in this respect to join substrates of substrate materials together without having to exert an increased effort for a coating with additional coating processes to be carried out and to be able to achieve a good quality of the join connection in so doing. In the method in accordance with the invention a pretreatment of at least one join surface of a substrate to be joined is carried out in low pressure oxygen plasma prior to the actual joining. On the joining, a contact force acts on the substrates to be joined in the range 2 kPa to 5 MPa and in this process a heat treatment is carried out at an elevated temperature of at least 100° C. and at under pressure conditions of a maximum of 10 mbar, preferably <10−3 mbar. |
申请公布号 |
EP2678287(A1) |
申请公布日期 |
2014.01.01 |
申请号 |
EP20120706523 |
申请日期 |
2012.02.21 |
申请人 |
FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN WISSENSCHAFT E.V.;FRIEDRICH-SCHILLER-UNIVERSITAET JENA |
发明人 |
KALKOWSKI, GERHARD;ROTHHARDT, CAROLIN;ROHDE, MATHIAS;EBERHARDT, RAMONA |
分类号 |
C03C27/00;B23K20/02;B23K20/24;C03B23/203;C03C23/00;C03C27/06;C03C27/08;C04B37/04;H01L21/18;H01L21/20 |
主分类号 |
C03C27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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