发明名称 |
POLISHING APPARATUS AND POLISHING METHOD |
摘要 |
<p>A polishing apparatus has a polishing tape (21), a supply reel (22) for supplying the polishing tape (21) to a contact portion (30) at which the polishing tape (21) is brought into contact with a notch portion (11) of a substrate (10), and a take-up reel (23) for winding up the polishing tape (21) from the contact portion (30). The polishing apparatus also has a first guide portion (24) having as guide surface (241) for supplying the polishing tape (21) directly to the contact portion (30), and a second guide portion (25) having a guide surface for supplying the polishing tape (21) tot the take-up reel (23). The guide surface (241) of the first guide portion (24) and/or the guide surface of the second guide portion (25) has a shape corresponding to a shape of the notch portion (11) of the substrate (10).</p> |
申请公布号 |
EP1810321(B1) |
申请公布日期 |
2014.01.01 |
申请号 |
EP20050795169 |
申请日期 |
2005.10.12 |
申请人 |
EBARA CORPORATION |
发明人 |
KUBOTA, TAKEO;SHIGETA, ATSUSHI;TOYOTA, GEN;TAKAHASHI, TAMAMI;FUKUOKA, DAISAKU;ITO, KENYA |
分类号 |
H01L21/304;B24B9/00;B24B21/00 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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