| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing a decrease in reliability and a decrease in manufacturing yield. <P>SOLUTION: The semiconductor device comprises a semiconductor element 1, a sealing member 2 for resin sealing the semiconductor element 1, and five lead terminals 3a to 3e electrically connected to the semiconductor element 1 and pulled out from an end face 2a of the sealing member 2 so as to extend in the identical direction (in an arrow L direction). Resin parts 6 with uniform distances from the end face 2a of the sealing member 2 are respectively provided at the base part side of the lead terminals 3a to 3e for the sealing member 2 in the direction (the arrow L direction) from the base part of the lead terminals 3a to 3e to the end parts of the lead terminals 3a to 3e. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
