| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To utilize an internal space on a BGA (Ball Grid Array) package effectively to reduce cost. <P>SOLUTION: In a semiconductor integrated circuit device, the lower surface 1a of a BGA package 1 has many ball-shaped terminals 2 arranged in a central section D1 and a peripheral section D2 thereon in a grid pattern of multiple lines; an approximately rectangular-shaped hollow section D3 is formed between the central section D1 and the peripheral section D2 on the lower surface 1a; a mounting area E is formed in place on one surface 3a of a printed-wiring substrate 3 in such a manner as to face the BGA package 1; the mounting area E including many lands 5 arranged in a central area E1 and a peripheral area E2 thereon in a grid pattern of multiple lines in such a manner as to face the respective ball-shaped terminals 2; and an approximately rectangular-shaped middle area E3 is formed between the central area E1 and the peripheral area E2 in the mounting area E, wherein the BGA package 1 is adapted to be mounted on the one surface 3a of the printed-wiring substrate 3. A peripheral circuit C including various electronic components Ca is provided in the middle area E3 in the mounting area E. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
