Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device

摘要

A method for producing an encapsulating layer-covered semiconductor element (10) includes the steps of preparing a support sheet (1) including a hard support board (2); disposing a semiconductor element (4) at one side in a thickness direction of the support sheet (1); disposing an encapsulating layer (5) formed from an encapsulating resin composition containing a curable resin at the one side in the thickness direction of the support sheet so as to cover the semiconductor element (4); curing the encapsulating layer (5) to encapsulate the semiconductor element (4) by the encapsulating layer that is flexible; cutting the encapsulating layer (5) that is flexible corresponding to the semiconductor element (4) to produce an encapsulating layer-covered semiconductor element (10); and peeling the encapsulating layer-covered semiconductor element (10) from the support sheet (1).