发明名称 Circuit board arrangement including heat dissipater
摘要 A circuit board arrangement includes a heat dissipater. A cooling body is arranged near a first circuit board and a second circuit board. Both circuit boards have electronic devices on two major surfaces. The cooling body is arranged between the electronic devices on one surface of the first circuit board and the electronic devices on one surface of the second circuit board. The circuit boards are supported by fixing elements of the cooling body.
申请公布号 US7365990(B2) 申请公布日期 2008.04.29
申请号 US20050311701 申请日期 2005.12.19
申请人 INFINEON TECHNOLOGIES AG 发明人 RAGHURAM SIVA
分类号 H05K7/20 主分类号 H05K7/20
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