发明名称 Method of fabricating an interconnection layer above a ferroelectric capacitor
摘要 A highly reliable semiconductor device having a ferroelectric capacitor structure by sufficiently preventing the H<SUB>2 </SUB>attack without damaging the function of an interlayer insulating film covering interconnections and the like to obtain a high capacitor performance. The position of a semiconductor substrate mounted on and secured to a substrate support plate in an HDP-CVD system is adjusted in the vertical direction, whereby a second HDP-CVD oxide film is deposited so that voids are formed between aluminum interconnections at lower positions than the height of the aluminum interconnections.
申请公布号 US7364964(B2) 申请公布日期 2008.04.29
申请号 US20050133267 申请日期 2005.05.20
申请人 FUJITSU LIMITED 发明人 IZUMI KAZUTOSHI
分类号 H01L21/8242 主分类号 H01L21/8242
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