| 摘要 |
<p>An ultra-thin surface-mounted LED(light emitting diode) is provided to improve reflectivity and directivity of light reflected from a light emitting chip to the outside by forming a tilted surface in a cavity in which a light emitting chip is installed and by plating a metal material with high reflectivity on the tilted surface. A printed circuit board(110) includes at least one insulation layer(111), upper and lower metal layers(112,113) formed on and under the insulation layer. A plating layer(120) is formed in the inner surface of a cavity(C) in a manner that a partial region of the insulation layer is etched to expose the lower metal layer. A light emitting chip(130) is installed in the cavity, wire-bonded and electrically connected to external power. A mold part(140) is formed on the printed circuit board to surround the light emitting chip. The plating layer can include first and second plating layers(121,122). The first plating layer is plated on the edge of the upper metal layer, the lower metal layer and the insulation layer. The second plating layer is plated on the inner surface of the cavity and the upper metal layer adjacent to the inner surface of the cavity.</p> |
