| 摘要 |
A substrate processing apparatus is provided to prevent failure due to a processing solution and to improve efficiency of a substrate processing procedure and productivity by uniformly providing the processing solution on the substrate. A substrate processing apparatus includes a chamber(10), a processing solution supply unit(30), an injection member(31), a supply line(34), and a pressure maintenance member(33). The chamber receives a substrate(1). The processing solution supply unit supplies processing solution. The injection member is provided at the chamber, and includes a plurality of nozzles injecting the processing solution onto the substrate. The supply line connects the injection member to the processing solution supply unit, and supplies the processing solution to the injection member. The pressure maintenance member connected both ends of the injection member to each other in order to uniformly maintain the pressure of the injection member.
|
