| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve the problem that transmission characteristics of interconnections are unstable in the conventional semiconductor device. <P>SOLUTION: The semiconductor device 1 has a high-frequency interconnection 10, a dummy conductor pattern 20, an interconnection 30, and another dummy conductor pattern 40. The dummy conductor pattern 20 is disposed near the high-frequency interconnection 10, while the dummy conductor pattern 40 is disposed near the interconnection 30. A minimum value d1 for the distance between the high-frequency interconnection 10 and the dummy conductor pattern 20 is larger than a minimum value d2 for the distance between the interconnection 30 and the dummy conductor pattern 40. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
