发明名称 |
Semiconductor packages having passive elements mounted thereonto |
摘要 |
A semiconductor package onto which a plurality of passive elements is mounted. A substrate includes a first surface and a second surface. A semiconductor chip is on one of the first surface and the second surface of the substrate. A plurality of passive elements are on the substrate. The plurality of passive elements include a plurality of first passive elements and a plurality of second passive elements that are taller than the plurality of first passive elements. The plurality of first passive elements are on at least one of the first surface and the second surface, and at least two of the plurality of second passive elements are on the second surface. |
申请公布号 |
US8618671(B2) |
申请公布日期 |
2013.12.31 |
申请号 |
US20100904502 |
申请日期 |
2010.10.14 |
申请人 |
KWON HEUNG-KYU;LIM HYUNG-JUN;CHO BYEONG-YEON;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KWON HEUNG-KYU;LIM HYUNG-JUN;CHO BYEONG-YEON |
分类号 |
H01L23/02;H01L21/00;H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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