发明名称 Layered substrate, light-emitting diode including the layered substrate and lighting device using the light-emitting diode
摘要 A layered substrate includes a first substrate including an upper surface, a lower surface, a peripheral surface between peripheral edges of the upper surface and the lower surface, and a cut portion cut into the peripheral surface and passing through the upper surface and the lower surface, and a second substrate including an upper surface, a lower surface, and a peripheral surface between peripheral edges of the upper surface and the lower surface, and the lower surface of the second substrate layered on the upper surface of the first substrate and closing the cut portion of the first substrate from above. The second substrate includes a heat conductor that is thermally connected to an element to be mounted on the upper surface of the second substrate, the heat conductor configured to thermally extend to the cut portion of the first substrate.
申请公布号 US8618573(B2) 申请公布日期 2013.12.31
申请号 US201213584446 申请日期 2012.08.13
申请人 SUGIURA MIHARU;MIYASHITA JUNJI;CITIZEN ELECTRONICS CO., LTD.;CITIZEN HOLDINGS CO., LTD. 发明人 SUGIURA MIHARU;MIYASHITA JUNJI
分类号 H01L33/64;H01L23/04;H05K7/04 主分类号 H01L33/64
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