发明名称 Electronics component embedded PCB
摘要 An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line.
申请公布号 US8618421(B2) 申请公布日期 2013.12.31
申请号 US20100915707 申请日期 2010.10.29
申请人 BYUN JUNG-SOO;CHUNG YUL-KYO;PARK HWA-SUN;LEE KYUNG-MIN;KIM MIKE;LEE DOO-HWAN;SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 BYUN JUNG-SOO;CHUNG YUL-KYO;PARK HWA-SUN;LEE KYUNG-MIN;KIM MIKE;LEE DOO-HWAN
分类号 H05K1/16 主分类号 H05K1/16
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