发明名称 |
Electronics component embedded PCB |
摘要 |
An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line. |
申请公布号 |
US8618421(B2) |
申请公布日期 |
2013.12.31 |
申请号 |
US20100915707 |
申请日期 |
2010.10.29 |
申请人 |
BYUN JUNG-SOO;CHUNG YUL-KYO;PARK HWA-SUN;LEE KYUNG-MIN;KIM MIKE;LEE DOO-HWAN;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
BYUN JUNG-SOO;CHUNG YUL-KYO;PARK HWA-SUN;LEE KYUNG-MIN;KIM MIKE;LEE DOO-HWAN |
分类号 |
H05K1/16 |
主分类号 |
H05K1/16 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|