发明名称 Apparatus and methods for forming an electrical conduction path through an insulating layer
摘要 One embodiment disclosed relates to an apparatus forming an electrical conduction path through an insulating layer on a surface of a substrate. A first radiation source is configured to emit radiation to a first region of the insulating layer, and a first electrical contact is configured to apply a first bias voltage to the first region. A second radiation source is configured to emit radiation to a second region of the insulating layer, and a second electrical contact is configured to apply a second bias voltage to the second region. The conductivities of the regions are increased by the radiation such that conductive paths are formed through the insulating layer at those regions. In one implementation, the apparatus may be used in an electron beam instrument. Another embodiment relates to a method of forming an electrical conduction path through an insulating layer. Other embodiments, aspects and features are also disclosed.
申请公布号 US8618513(B2) 申请公布日期 2013.12.31
申请号 US201213468617 申请日期 2012.05.10
申请人 PLETTNER TOMAS;NASSER-GHODSI MEHRAN;HAYNES ROBERT G.;GARCIA RUDY F.;KLA-TENCOR CORPORATION 发明人 PLETTNER TOMAS;NASSER-GHODSI MEHRAN;HAYNES ROBERT G.;GARCIA RUDY F.
分类号 G21K5/00 主分类号 G21K5/00
代理机构 代理人
主权项
地址