发明名称 METAL CORE MULTILAYER PRINTED WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To efficiently radiate heat, which has been released from a heating element, to the outside of a printed wiring board without impairing the packaging density of circuits and to mount an element on the side of the wiring board opposite to the side on which the heating element exists. <P>SOLUTION: A metal core multilayer printed wiring board (1) obtained by forming one or more of at least one inner layer of a laminate having an insulating layer and a conductor layer stacked alternately from a metal plate and using the metal plate as a core is characterized in that the metal plate (13) is disposed below a portion wherein a heating element (10) is to be mounted, and a surface layer over which the heating element (10) is to be mounted and the metal plate (13) of the inner layer are connected via a BVH (12) and a heat radiation layer (14) is formed over the surface layer. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2009021627(A) 申请公布日期 2009.01.29
申请号 JP20080238782 申请日期 2008.09.18
申请人 CMK CORP;ADVICS:KK;DENSO CORP 发明人 SHOJI HIROSHI;SAKAKIBARA KENJI;KABUNE HIDEKI
分类号 H05K3/46;H05K1/02;H05K1/05;H05K3/40;H05K7/20 主分类号 H05K3/46
代理机构 代理人
主权项
地址