发明名称 Semiconductor device comprising pillar array and contact array
摘要 A semiconductor device includes: a substrate having a base and a pillar array including a plurality of pillars; a plurality of bit lines, each of which is disposed between two adjacent ones of the columns of the pillar array; a plurality of word lines, each of which is connected to a corresponding one of the rows of the pillar array; and a contact array including a plurality of bit line contacts arranged in rows and columns. The bit line contacts of each column of the contact array are embedded in the base and are electrically connected to a respective one of the bit lines. Each bit line contact intersects the respective one of the bit lines and extends between and is electrically connected to two adjacent ones of the pillars.
申请公布号 US8618591(B2) 申请公布日期 2013.12.31
申请号 US201213455371 申请日期 2012.04.25
申请人 NAGAI YUKIHIRO;REXCHIP ELECTRONICS CORPORATION 发明人 NAGAI YUKIHIRO
分类号 H01L27/108;H01L29/94 主分类号 H01L27/108
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