| 摘要 |
PROBLEM TO BE SOLVED: To improve connection reliability by uniformizing the junction area of electrode of an integrated substrate in a structure in which the integrated substrates are laminated three dimensionally. SOLUTION: By providing a local level difference portion 13 in a second surface 5 which is the non-forming side of integrated circuit portion of electronic components, the thickness of an integrated substrate 2 is made to have a difference between a central portion and an end portion, thereby, the depth of warpage and the local level difference portion 13 are canceled out even if there is the warpage in the electronic components. Since all of the second electrodes 6 can be made to exist in almost the same plane in the second surface 5, the junction area of electrode of the integrated substrate is made to be uniformized even in the structure laminated three dimensionally, exerting the effect of improving the connection reliability. COPYRIGHT: (C)2009,JPO&INPIT |
