| 摘要 |
The present invention relates to a silicon resin composition, a semi-cured body sheet, a silicon cured body manufacturing method, a light emitting diode device, and a manufacturing method thereof and, more specifically, to a manufacturing method of a light emitting diode device, a manufacturing method for a silicon cured body utilized for the same, a semi-cured body sheet utilized for the same, a silicon resin composition, and a light emitting diode device manufactured by the manufacturing method of the light emitting diode device. The silicon resin composition includes polysiloxane containing at least a pair of condensable substituents capable of being condensed by heating; and at least a pair of applicable substituents capable of being applied by an active energy line. [Reference numerals] (AA) Surface side;(BB) Opposite site |
