| 摘要 |
OF THE DISCLOSUREAn apparatus for continuous simultaneous electroplating of two metals havingsubstantially different standard electrodeposition potentials (e.g., for deposition of Sn-Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin),ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations ofplating bath components for extended periods of use.Fig. 3 |
