| 摘要 |
A method for forming a circuit of a printed wiring board, thermosetting resin composition, and a printed wiring board are provided, which is capable of forming a fine circuit without a need of a plating pre-processing process and a grinding process of metal excessively formed by a plating film or a conductive coating film and improving the processability of an insulating resin layer by laser irradiation or adhesion properties between the insulating resin layer and a circuit film. A method for forming a circuit of a printed wiring board comprises the steps of: a recess structure forming process for forming a recess structure by removing an insulating resin layer with the irradiation of ultraviolet laser with a pulse width of nanosecond for the insulating resin layer having ultraviolet absorption properties on a metal-clad laminate; and a disperse applying process for applying, by an inkjet method, disperse including metal nanoparticles to the inside of the recess structure formed by the recess structure forming process. |
