发明名称 SINGLE FACED PCB APPARATUS CAPABLE OF DOUBLE FACED SOLDERING
摘要 The present invention relates to a single sided PCB apparatus capable of a double sided soldering, which secures cost competitiveness by enabling the double-sided soldering in the single sided PCB apparatus. The single sided PCB apparatus capable of the double sided soldering of the present invention comprises: a base board; multiple mounting pads which are formed in the lower side of the base board and are soldered by mounting various circuit components; one or more pin penetration holes which are formed by penetrating the base board and are penetrated by terminal pins; a soldering pad which is formed around the pin penetration hole of the lower side of the base board; a circuit pattern which is formed in the lower side of the base board and electrically connects the mounting pad or the soldering pad; and a hollow metal container which is inserted and fixated into the pin penetration hole. A hanging edge which is formed in a bigger diameter than the pin penetration hole is formed in the lower end of the metal container. A soldering sheet in which the terminal pins are soldered is formed by being spread around the pin penetration holes by caulking in the upper end of the metal container. In the described composition, the hanging edge is soldered in the soldering pad. The single sided PCB apparatus is mounted inside of the housing of a brushless motor and the terminal pins are the U, V, W, and COM terminal pins of the stator of the brushless motor.
申请公布号 KR20130142831(A) 申请公布日期 2013.12.30
申请号 KR20120066387 申请日期 2012.06.20
申请人 SCD 发明人 JEONG, JUNG HEE
分类号 H05K1/18;H05K3/34 主分类号 H05K1/18
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