| 摘要 |
<p>The present invention relates to a panel bonding apparatus capable of bonding two panels constituting a panel product automatically and rapidly. The panel bonding apparatus by the present invention includes: a first turn table where a panel placement plate placed with a first panel is installed and transports the panel placement plate along a first rotation route; an adhesive material coating device coating an adhesive material on one side of the first panel; a panel bonding unit; a second turn table where the panel bonding unit is installed and transports the panel bonding unit along a second rotation route; a panel transportation device transporting the first panel placed on the panel placement plate to the panel bonding unit; and a control device controlling overall operation of the apparatus. The panel bonding unit has: a lower panel placement plate where the first panel is placed; an upper panel placement plate which is arranged higher than the lower panel placement plate and is placed with the second panel; and an elevation device elevating the lower panel placement plate or the upper panel placement plate in order to bond the first panel and the second panel.</p> |
