| 摘要 |
lS S TRACTSEMI CONDUCTOR DEVICE5 A semiconductor device comprises a lead frame havinga die pad portion or a circuit board, one or more semiconductor elements mounted on the die pad portion of the lead frame or on the circuit board, a copper wire that electrically connects electrical joints provided on the10 lead frame or the circuit board to an electrode pad provided on the semiconductor element, and an encapsulating member which encapsulates the semiconductor element and the copper wire, wherein the electrode pad and/or the encapsulating member having predetermined properties are0 combined with the copper wire having predetermined properties.Fig. None2025 |
