METHOD OF FORMING THERMAL INTERFACE MATERIAL AND HEAT DISSIPATION STRUCTURE

摘要

The present invention relates to a method of forming a thermal interface material characterized by curing a thermosetting polymer composition by heating under pressure between an electronic part and a heat sink, the thermosetting polymer composition comprising (A) a thermosetting polymer, (B) a bismuth/tin-based alloy powder which melts at a temperature lower than the curing temperature of component (A) and has an average particle size of from 1 to 100 mum, and (C) a roughly spherical thermally conductive powder which does not melt at the curing temperature of component (A) and has an average particle size of from 0.1 to 50 mum. The thermal interface material efficiently transmits heat generated from an electronic part to a heat sink.