| 摘要 |
In one embodiment, wafer-scale antenna module is provided that includes: a substrate having a first surface and an opposing second surface; a plurality of conductive contact regions extending from the first surface into the substrate towards the second surface; active circuitry formed in the substrate adjacent the second surface, the active circuitry electrically coupled to the conductive contact regions; an insulating layer adjacent the first surface, the insulating layer forming a plurality of vias arranged corresponding to the plurality of conductive contact regions, each via forming an opening at the corresponding conductive contact region; and a plurality of antennas formed on the insulating layer corresponding to the plurality of vias; wherein each via contains an electrical conductor to electrically couple the corresponding contact region to the antenna corresponding to the via, whereby a resulting separation between the driving circuitry and the antennas aids an electrical isolation of the driving circuitry from the antennas.
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