ELECTRONIC COMPONENT MODULE

摘要

Disclosed is an electronic component module, wherein a conductive land on a wiring board and a columnar connecting terminal member are bonded to each other with a bonding section therebetween, and a resin layer that seals the connecting terminal member is formed on the wiring board, said electronic component module suppressing flow out of a bonding material constituting the bonding section in a reflow step that is conducted at the time of mounting the electronic component module on a mounting substrate. An end surface (9) of a connecting terminal member (6), said end surface being on the exposed side of the connecting terminal member, has formed thereon a plating layer (15) composed of a Cu-M based alloy (M is Ni and/or Mn), which is capable of generating an intermetallic compound with a Sn based low melting point metal contained in the bonding material constituting the bonding section (10), and which has a difference of 50 % or more between the lattice constant of the alloy and that of the intermetallic compound. Even if the bonding material is re-melted to flow out to the outside in a reflow step, the bonding material is brought into contact with the Cu-M based plating layer (15), and a high melting point alloy body (27) composed of the intermetallic compound is formed to cover the interface between the connecting terminal member (6) and the resin layer (11).