| 摘要 |
Embodiments of the present invention provide a heat dispersion device used in a terminal and a terminal. The terminal comprises a printed circuit board, and an element disposed on the printed circuit board. The heat dispersion device is a heat dispersion cover, and the heat dispersion cover is directly disposed above the element and used to guide heat generated by the working element out. The heat dispersion cover is disposed in the terminal, the heat dispersion cover is directly located on the printed circuit board in the terminal, heat generated by the element is conducted evenly due to the heat conduction property of the heat dispersion cover, and therefore, the problem of local overheating that occurs when the terminal works is resolved, and the user experience is improved. |
