| 摘要 |
Disclosed are: a resin composition which comprises 10 to 90% by mass of (A) a component to be polymerized containing a cyclic compound, such as a cyclic polyphenylene sulfide, a cyclic polyphenylene ether ether ketone, a cyclic polyphenylene ether ketone or a cyclic polyphenylene ether sulfone, and 90 to 10% by mass of (B) a thermosetting resin, the components (A) and (B) each being capable of undergoing a reaction to increase the molecular weight by itself when heated; a composite cured product comprising the resin composition; and a method of producing the composite cured product. According to the present invention, a resin composition having good moldability and impregnation properties; a method of producing a good composite cured product having a reduce amount of voids using the resin composition; and a cured product obtained by the method can be provided. |
