摘要 |
A contact spring assembly (30) for an electronic device includes a mounting portion (31), a press spring (32), and a deformable spring (37). The press spring and the deformable spring are respectively bent from the mounting portion. The press spring resists the deformable spring. The press spring is configured to be moved along a first direction and push the deformable spring to move along a second direction different from the first direction.
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