发明名称 Contact spring assembly for electronic devices
摘要 A contact spring assembly (30) for an electronic device includes a mounting portion (31), a press spring (32), and a deformable spring (37). The press spring and the deformable spring are respectively bent from the mounting portion. The press spring resists the deformable spring. The press spring is configured to be moved along a first direction and push the deformable spring to move along a second direction different from the first direction.
申请公布号 US7578712(B2) 申请公布日期 2009.08.25
申请号 US20070964801 申请日期 2007.12.27
申请人 CHI MEI COMMUNICATION SYSTEMS, INC. 发明人 CHANG CHENG-LUNG
分类号 H01R11/22 主分类号 H01R11/22
代理机构 代理人
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