发明名称 BAGASSE MOLDING
摘要 <p>A bagasse molding obtained by molding bagasse that is strained lees of sugar cane. The bagasse is bonded with an adhesive component that is a denatured bagasse component having been formed in the course of hot press-molding. The bagasse is bonded in the presence of a polyvalent carboxylic acid and an organic sulfonic acid. By the combined use of the polyvalent carboxylic acid with the organic sulfonic acid, a molding which has high adhesiveness and high water tolerance and releases little formaldehyde and in which the generation of fungi is suppressed can be obtained.</p>
申请公布号 WO2013190777(A1) 申请公布日期 2013.12.27
申请号 WO2013JP03386 申请日期 2013.05.29
申请人 PANASONIC CORPORATION 发明人 SUGAWARA, RYO
分类号 B27N3/04;C09J5/00;C09J11/06 主分类号 B27N3/04
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