CONTROLLING ADHESIVES BETWEEN SUBSTRATES AND CARRIERS
摘要
Controlling adhesives between substrates and carriers includes forming a depression into a bonding area of a backside surface of a substrate of a print head where the bonding area being formed proximate an ink feed slot formed through the thickness of the substrate from the backside surface to a front side surface; placing an adhesive between the bonding area and a substrate carrier, and moving the substrate and the substrate carrier together such that the adhesive flows into the depression.
申请公布号
WO2013191677(A1)
申请公布日期
2013.12.27
申请号
WO2012US42943
申请日期
2012.06.18
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;RIVAS, RIO;FRIESEN, ED;THURBER, LAWRENCE;CLARK, GARRETT E.;BIGFORD, ROSANNA L.
发明人
RIVAS, RIO;FRIESEN, ED;THURBER, LAWRENCE;CLARK, GARRETT E.;BIGFORD, ROSANNA L.