| 摘要 |
The invention relates to a manufacturing method comprising the formation on a first substrate (10) of elemental LED or photovoltaic structures, each comprising at least one p-type layer (20), an active zone (18) and an n-type layer (12), formation of a first planar metal layer (42) on the elemental structures, provision of a transfer substrate (50) comprising a second planar metal layer (46), assembly of the elemental structures with the transfer substrate (50) by bonding of the first and second metal layers (42, 46) by molecular adhesion at room temperature, and removal of the first substrate (10). |
