| 摘要 |
A laser scribing system for removing portions of a thin film layer positioned on a large-area substrate is provided. The system includes a source laser, a diffractive optical element configured to produce one or more optical scribing beams from a laser beam provided by the source laser, a blocking element, a scattering element, or a combination thereof, the blocking element and the scattering element being positioned between the diffractive optical element and the large-area substrate and configured to block one or more portions of unwanted diffracted beams, one or more of the optical scribing beams, or a combination thereof, focusing optics configured to focus the optical scribing beams, and a control system configured to dynamically position the optical scribing beams with respect to the substrate and control the source laser, an alignment and spacing of the diffractive optical element, the blocking element, the scanning element, or the combination thereof, and the focusing optics. |
