| 摘要 |
<p>The present invention is related to directional material deposition in physical vapor deposition (PVD) technology. In particular, the invention concerns PVD apparatus, which comprises : - a vacuum tight outer vessel accommodating a material source, - at least two substrates arranged to define a substrate plane spaced apart from said material source, - said substrates facing the material source with a surface to be treated. The diameter of this material source is smaller, in particular significantly smaller, than the diameter of any of the substrates. This way a narrow angular distribution and a high level of uniformity is achieved at low substrate temperature.</p> |
