SOLDER-PASTE DROPLET EJECTION APPARATUS, PATTERNING SYSTEM HAVING THE SAME AND CONTROL METHOD THEREOF

摘要

According to an embodiment of the present invention, to achieve the appearance of a solder paste droplet ejection apparatus includes a nozzle cap comprising an electrothermal wire for heating, a nozzle part surrounded to be separated by the nozzle gap, an injection probe surrounded to be separated by the nozzle part, and a transfer part for minute movement formed on the upper part of the nozzle cap. Solder paste supplied between the nozzle and the ejection probe is ejected with droplets along the ejection probe.