THERMAL MANAGEMENT CIRCUIT BOARD FOR STACKED SEMICONDUCTOR CHIP DEVICE

摘要

A method of assembling a semiconductor chip device is provided. The method includes providing a first circuit board (130) that has a plurality of thermally conductive vias (180a, 180d). A second circuit board (125) is mounted on the first circuit board (130) over and in thermal contact with the thermally conductive vias (180a, 180d). The second circuit board (125) includes first side (140) facing the first circuit board (130) and a second and opposite side (135).