摘要 |
The present invention relates to a device to inject epoxies for LED chips and, more specifically, to the device to inject the epoxies for the LED chips, capable of being exclusively used in an LED chip in which two or more LED installation grooves are formed and rapidly injecting the epoxies by simultaneously injecting the epoxies by two to two or more LED installation grooves formed in the LED chip. The device to inject the epoxies for the LED chips of the present invention comprises: a transfer stand in which is able to move from left to right, forwards and backwards, and in an upper/lower direction, a pin holder mounted on the front of the transfer stand and in which a vertical screw hole is formed, and an epoxy injecting unit mounted on the vertical screw hole. The epoxy injecting unit includes: a vertical pipe in which a screw unit is formed at outer surface, a height can be controlled at the vertical screw hole, a vertical screw hole is formed in the inside, and a vertical long hole in which the upper part is opened is formed at the circumference; a press shaft inserted from the upper part to the lower part of the vertical pipe and in which a protrusion is formed to be inserted into the vertical long hole; two injecting pins formed to be protruding from both sides of the lower press shaft towards the lower part and injecting the epoxies by two to the LED installation grooves formed in the LED chips by pressing the epoxies of an epoxy container; a vertical spring mounted inside the vertical pipe in which is the upper part of the press shaft; and a bolt combining with the upper part of the screw hole inside the vertical pipe and pressing the upper part of the vertical spring. |