MANUFACTURING METHOD AND MANUFACTURING DEVICE OF COMPOUND SEMICONDUCTOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method and a manufacturing device of a compound semiconductor substrate which can manufacture a substrate having an intended plane direction and less warpage by a simple method.SOLUTION: A manufacturing method of a compound semiconductor substrate 10 comprises steps of: preparing a plurality of holding parts 5 each having a holding surface 5d in which inclination of the holding surface 5d can be adjusted; causing the plurality of holding parts 5 to hold a plurality of compound semiconductor ingots 1, respectively; adjusting orientation of each of the plurality of ingots 1 by adjusting inclination of each of the holding surfaces 5d of the plurality of holding parts 5; and simultaneously cutting the plurality of ingots 1 to cut compound semiconductor substrates 10 each having an intended principal surface 2.